Gaoche’s Yibin project achieves success with the first silicon wafer

The GC-800XP diamond wire crystalline silicon slicing machine, independently developed by Gaoche, is employed for high-precision cutting, focusing on large-size, thin slices, and fine lines. Image Credit weixin.

Gaoche achieves a milestone with the production of the first silicon wafer for the Yibin 25 GW photovoltaic project, using advanced slicing technology. The project, set for full production by June, incorporates high-precision cutting equipment, reducing costs and enhancing productivity. Intelligent workshops, part of the initiative, promote overall connectivity, reinforcing Yibin’s commitment to technological, product, and cost leadership in the industry.