Gaoche achieves a milestone with the production of the first silicon wafer for the Yibin 25 GW photovoltaic project, using advanced slicing technology. The project, set for full production by June, incorporates high-precision cutting equipment, reducing costs and enhancing productivity. Intelligent workshops, part of the initiative, promote overall connectivity, reinforcing Yibin’s commitment to technological, product, and cost leadership in the industry.
Gaoche’s Yibin project achieves success with the first silicon wafer
The GC-800XP diamond wire crystalline silicon slicing machine, independently developed by Gaoche, is employed for high-precision cutting, focusing on large-size, thin slices, and fine lines. Image Credit weixin.