Funds raised for Ultra-fine Tungsten alloy wire production in PV

Xianglu Tungsten Industry plans to raise 840.8871 million yuan for a project producing ultra-fine tungsten alloy wire for photovoltaics. The focus on diamond wire, a core consumable in silicon wafer cutting, aligns with industry trends toward larger, thinner, and N-type silicon wafers. With domestic PV silicon wafer manufacturers adopting tungsten wire busbars, the company aims to secure a market share with the annual output of 30 billion meters of ultra-fine tungsten alloy wire production project for photovoltaics. Despite a dip in net profit, the initiative is expected to enhance long-term profitability.