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The study highlights how conductive paste pads enable efficient current extraction from the ITO layer, advancing SHJ cell connectivity and performance. Image source: Science Direct
Researchers from RWTH Aachen University, in collaboration with Forschungszentrum Jülich GmbH, have introduced Direct Wire Bonding (DWB) as a low-temperature method to interconnect finger-free Silicon Heterojunction (SHJ) solar cells using copper wires. The wires are attached to SHJ cells via discrete pads of conductive paste, enabling direct current extraction from the indium tin oxide (ITO) layer and transport to sequentially connected cells. The study compares the performance of DWB modules with traditional SHJ modules, showing a 0.03% absolute efficiency improvement over 0BB and multi-wire solutions while reducing material consumption. Economic analysis reveals DWB can reduce production costs to 18% of other SHJ metallization and interconnection methods, addressing material scarcity and cost challenges in photovoltaics.
Source: Science Direct