Dow,a global materials science powerhouse headquartered in Midland, haslaunched DOWSIL™ EG-4175 Silicone Gel in Michigan. The gel was designed for next-generation insulated gate bipolar transistor (IGBT) modules used in electric vehicles, photovoltaic panels, and wind turbines. It withstood temperatures up to 180 °C and supported higher power densities, improved efficiency, and reduced power losses. The material absorbed vibrations, had self-healing properties, featured self-priming adhesion, and cured at room temperature or with heat acceleration. It provided dielectric strength, thermal resistance, and protection for Generation 7 IGBT technology operating at higher voltages. The product joined Dow’s existing portfolio, including DOWSIL™ EA-7158 Adhesive, and was made available globally.