AIKO, a China-based manufacturer of PV modules, has developed a proprietary copper interconnection for its ABC modules to replace silver, which represents nearly one-fifth of global silver demand driven by photovoltaic manufacturing. According to AIKO, copper’s lower resistivity of 1.7 μΩ·cm, compared to 5 μΩ·cm for silver pastes, has improved current collection, energy output, and thermal performance. AIKO stated that its electroplated copper process avoids high-temperature firing, reducing thermal stress, impurities, and wafer surface damage. AIKO has used uniform copper ribbons and fingers to enhance solder joint strength beyond 5 N and increase module durability. The Stellar ABC series is the only copper-interconnected, double-glass module qualified for floating PV installations. AIKO said that these modules have shown significantly lower power loss than TOPCon under mechanical stress and harsh conditions. EPCs and asset owners are expected to benefit from better shading tolerance, reduced maintenance, improved fire performance, and long-term material cost stability in large-scale solar applications.