China based Hongyuan Green Energy Co., Ltd. (HY SOLAR) has recorded the rollout of its first batch of 40 μm ultra-thin silicon wafers. The production took place at the company’s monocrystalline silicon wafer manufacturing base in Baotou, Inner Mongolia. The wafers produced using independently developed slicing equipment, included both full-size and half-cut formats and met technical requirements for flexible solar cell applications. The company relied on long-standing experience in photovoltaic cutting equipment, process optimization, and intelligent control systems to reduce kerf loss, improve consistency, and limit micro-cracks. The production line integrated online monitoring, precision tension control, and self-developed core components to support stable operation. HY SOLAR’s wafers demonstrated controlled oxygen and carbon content, uniform resistivity, and compatibility with multiple applications, while also obtaining French ECS carbon footprint certification.